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www.rohm.com tsz02201-0rar0g200230-1-2 ? 201 3 rohm co., ltd. all rights reserved. 1/ 44 03.dec.2014 rev.004 tsz22111 ? 14 ? 001 operational amplifiers input/output full swing low voltage operating cmos op erational amplifiers bu7261g bu7261sg bu7262xxx bu7262sxxx bu7264 xx bu7264sxx general description bu7261g,bu7262xxx,bu7264xx are cmos operational amplifier of the input/output full swing low voltage operation. also, bu7261sg,bu7262sxxx,bu7264sxx which expanded the operating temperature range perform a lineup. it is most suitable for a sensor amplifier an d a battery-powered equipment to have a high slew rate, the ch aracteristic of the low input bias current. features ? operable with low voltage ? i nput -output f ull swing ? high slew rate ? wide temperature range ? low input bias current applications ? sensor a mp lifier ? battery-powered equipment ? portable equipment ? consumer equipment key specifications ? operating supply voltage range(s ingle supply): +1.8v to +5.5v ? operating temperature range: bu7261g, bu7262xxx, bu7264xx: -40c to +85c bu7261sg, bu7262sxxx, bu7264sxx: -40c to +105c ? slew rate: 1.1 v/s(typ) ? input offset current: 1pa (typ) ? input bias current: 1pa (typ) packages w(typ) x d(typ) x h(max) ssop5 2.90mm x 2.80mm x 1.25mm sop8 5.00mm x 6.20mm x 1.71mm msop8 2.90mm x 4.00mm x 0.90mm vson008x2030 2.00mm x 3.00mm x 0.60mm sop14 8.70mm x 6.20mm x 1.71mm ssop-b14 5.00mm x 6.40mm x 1.35mm simplif ied schematic product structure silicon monolithic integrated circuit this product has no designed protection against radioactive ra ys. figure 1. simplified schematic (1 channel only) in+ out in - vdd vss v bias class ab control v bias datashee t downloaded from: http:///
datasheet www.rohm.com tsz02201-0rar0g200230-1-2 ? 201 3 rohm co., ltd. all rights reserved. 2/ 44 03.dec.2014 rev.004 tsz22111 ? 15 ? 001 bu7261g bu7261sg bu7262xxx bu7262sxxx bu7264 xx bu7264sxx pin configuration bu 7261 g, bu7261 sg : ssop5 bu7262f, bu7262sf : sop8 bu7262fvm, bu7262sfvm : msop8 bu7262nux, bu7262snux : vson008x2030 bu 7264f, bu 7264sf : sop 14 bu 7264f v, bu 7264sfv : ssop-b14 package ssop5 sop8 vson008x2030 msop8 sop14 ssop-b14 bu7261g bu7261sg bu7262f bu7262sf bu7262nux bu7262snux bu7262fvm bu7262sfvm bu7264f bu7264sf bu7264fv bu7264sfv pin no. pin name 1 in + 2 vss 3 in - 4 out 5 vdd pin no. pin name 1 out1 2 in1- 3 in1+ 4 vss 5 in2+ 6 in2- 7 out2 8 v dd pin no. pin name 1 out1 2 in 1- 3 in 1+ 4 vdd 5 in2+ 6 in2- 7 out2 8 out3 9 in3- 10 in3+ 11 vss 12 in4+ 13 in4- 14 out4 ch1 - + ch4 - + ch3 ch2 - + - + 1 2 3 4 14 13 12 11 5 6 7 10 9 8 in1+ in1- out1 vdd in2+ in2- out2 vss out3 in4+ in4- in3+ in3- out4 vss vdd out in - in+ 1 2 3 4 5 + ch 2 ch1 1 2 3 4 8 7 6 5 out2 vss vdd out1 in1- in1+ in2+ in2- downloaded from: http:///
datasheet www.rohm.com tsz02201-0rar0g200230-1-2 ? 201 3 rohm co., ltd. all rights reserved. 3/ 44 03.dec.2014 rev.004 tsz22111 ? 15 ? 001 bu7261g bu7261sg bu7262xxx bu7262sxxx bu7264 xx bu7264sxx ordering information b u 7 2 6 x x x x x - x x part number bu7261g bu7261 sg bu7262 xxx bu7262sxxx bu7264 xx bu7264sxx package g : ssop5 f : sop8, sop14 fv : ssop-b 14 fvm : msop8 nux : vson008x2030 packaging and forming specification e2: embossed tape and reel (sop8/sop14/ssop-b14) tr: embossed tape and reel (ssop5/msop8/vson008x2030) line- up t opr channels package orderable part number -40c to +85c 1ch ssop5 reel of 3000 bu7261g- tr 2ch sop8 reel of 2500 bu7262f- e2 msop8 reel of 3000 bu7262fvm- tr vson008x2030 reel of 4000 bu7262nux- tr 4ch sop14 reel of 2500 bu7264f- e2 ssop-b14 reel of 2500 bu7264fv- e2 -40c to +105c 1ch ssop5 reel of 3000 bu7261sg- tr 2ch sop8 reel of 2500 bu7262sf- e2 msop8 reel of 3000 bu7262sfvm- tr vson008x2030 reel of 4000 bu7262snux- tr 4ch sop14 reel of 2500 bu7264sf- e2 ssop-b14 reel of 2500 bu7264sfv- e2 downloaded from: http:///
datasheet www.rohm.com tsz02201-0rar0g200230-1-2 ? 201 3 rohm co., ltd. all rights reserved. 4/ 44 03.dec.2014 rev.004 tsz22111 ? 15 ? 001 bu7261g bu7261sg bu7262xxx bu7262sxxx bu7264 xx bu7264sxx absolute maximum ratings (t a =25 ) bu7261g, bu7262xxx, bu7264xx parameter symbol rating unit bu726 1g bu7262 xxx bu7264 xx supply voltage vdd- vss +7 v power dissipation p d ssop5 0.54 (note 1,7) - - w sop8 - 0.55 (note 2,7) - msop8 - 0. 47 (note 3,7) - vson008x2030 - 0. 41 (not e 4,7) - sop14 - - 0.45 (note 5,7) ssop-b14 0.70 (note 6,7) differential input voltage (note 8) v id vdd - vss v input common-mode voltage range v icm (vss - 0.3) to (vdd + 0.3) v input current (note 9) i i 10 ma operating supply voltage v opr +1 .8 to +5.5 v operating temperature t opr -40 to + 85 c storage temperature t stg - 55 to + 125 c maximum junction temperature t jmax + 125 c (note 1) to use at temperature above t a = 25 ? c reduce 5.4 mw / c . (note 2) to use at temperature above t a = 25 ? c reduc e 5.5 mw / c . (note 3) to use at temperature above t a = 25 ? c reduce 4.7 mw / c . (note 4) to use at temperature above t a = 25 ? c reduce 4.1 mw / c . (note 5) to use at temperature above t a = 25 ? c reduce 4.5 mw / c . (note 6) to use at temperature above t a = 25 ? c reduce 7. 0 mw / c . (note 7) mounted on a fr4 glass epoxy pcb 70mm70mm1.6mm (copper f oil area less than 3%). (note 8) the voltage difference between inverting input and non-inver ting input is the differential input voltage. then input pin voltage is set to more than v ss . (note 9) an excessive input current will flow when input voltages of more th an vdd+0.6v or less than vss -0.6v are applied. the input current can be set to less than the rated current by ad ding a limiting resistor. caution: operating the ic over the absolute maximum ratings may damage the ic. the damage can either be a short circuit bet ween pins or an open circuit between pins and the internal circuitry. therefore, it is impo rtant to consider circuit protection measures, such as adding a fuse, in case the ic is operated over the absolute maximum ratings. downloaded from: http:///
datasheet www.rohm.com tsz02201-0rar0g200230-1-2 ? 201 3 rohm co., ltd. all rights reserved. 5/ 44 03.dec.2014 rev.004 tsz22111 ? 15 ? 001 bu7261g bu7261sg bu7262xxx bu7262sxxx bu7264 xx bu7264sxx absolute maximum ratings (t a =25 ) - continued bu7261sg, bu7262sxxx, bu7264sxx parameter symbol rating unit bu7261sg bu726 2s xxx bu7264s xx supply voltage vdd- vss +7 v power dissipation p d ssop5 0.54 (note 10 ,16) - - w sop8 - 0.55 (note 11,16) - msop8 - 0. 47 (note 12,16) - vson008x2030 - 0. 41 (note 13,16) - sop14 - - 0.45 (note 14,16) ssop-b14 0.70 (note 15,16) differential i nput voltage (note 17) v id vdd - vss v input common-mode voltage range v icm (vss - 0.3) to (vdd + 0.3) v input current (note 18 ) i i 10 ma operating supply voltage v opr +1.8 to +5.5 v operating temperature t opr -40 to + 105 c storage temperature t stg - 55 to + 125 c maximum junction temperature t jmax + 125 c (note 10 ) to use at temperature above t a = 25 ? c reduce 5.4 mw / c . (note 11) to use at temperature above t a = 25 ? c reduce 5.5 mw / c . (note 12) to use at temperature above t a = 25 ? c reduce 4.7 mw / c . (note 13) to use at temperature above t a = 25 ? c reduce 4.1 mw / c . (note 14) to use at temperature above t a = 25 ? c reduce 4.5 mw / c . (note 15) to use at temperature above t a = 25 ? c reduce 7.0 mw / c . (note 16) mounted on a fr4 glass epoxy pcb 70mm70mm1.6mm (copp er foil area less than 3%). (note 17) the voltage difference between inverting input and non- inverting input is the differential input voltage. then input pin voltage is set to more than v ss . (note 18 ) an excessive input current will flow when input voltages of more than v dd+0.6v or less than vss -0.6v are applied. the input current can be set to less than the rated current by ad ding a limiting resistor. caution: operating the ic over the absolute maximum ratings may damage the ic. the damage can either be a short circuit bet ween pins or an open circuit between pins and the internal circuitry. therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the ic is operated over the absolute maximum ratings. downloaded from: http:///
datasheet www.rohm.com tsz02201-0rar0g200230-1-2 ? 201 3 rohm co., ltd. all rights reserved. 6/ 44 03.dec.2014 rev.004 tsz22111 ? 15 ? 001 bu7261g bu7261sg bu7262xxx bu7262sxxx bu7264 xx bu7264sxx electrical characteristics bu7261g, bu7261sg (u nless otherwise specified vdd=+3v, vss=0v, t a =25 ) parameter symbol temperature range limit unit conditions min typ max input offset voltage (note 19 , 20 ) v io 25 - 1 9 mv vdd=1.8 to 5.5v full range - - 10 input offset current (note 19) i io 25 - 1 - pa - input bias current (note 19) i b 25 - 1 - pa - supply current (note 20) i dd 25 - 250 550 a r l = a v =0db, in+=1.5v full range - - 600 maximum output voltage(high) v oh 25 vdd-0.1 - - v r l =10k maximum output voltage(low) v ol 25 - - vss+0.1 v r l =10k large signal voltage gain a v 25 70 95 - db r l =10k input common-mode voltage range v icm 25 0 - 3 v vss - vdd common-mode rejection ratio cmrr 25 45 60 - db - power supply rejection ratio psrr 25 60 80 - db - output source current (note 21) i source 25 4 10 - ma out=vdd-0.4v output sink current (note 21) i sink 25 5 12 - ma out=vss+0.4v slew rate sr 25 - 1.1 - v/s c l =25pf gain bandwidth gbw 25 - 2 - mhz c l =25pf, a v =40db phase margin 25 - 50 - deg c l =25pf, a v =40db total harmonic distortion + noise thd+n 25 - 0.05 - % out=0.8v p-p , f=1khz (note 19) absolute value (note 20 ) full range: bu7261: t a =- 40 to +85 bu7261s: t a =- 40 to +105 (note 21 ) under the high temperature environment, consider the power dissipation o f ic when selecting the output current. when the terminal short circuits are continuously output, the output curr ent is reduced to climb to the temperature inside ic. downloaded from: http:///
datasheet www.rohm.com tsz02201-0rar0g200230-1-2 ? 201 3 rohm co., ltd. all rights reserved. 7/ 44 03.dec.2014 rev.004 tsz22111 ? 15 ? 001 bu7261g bu7261sg bu7262xxx bu7262sxxx bu7264 xx bu7264sxx electrical characteristics - continued bu7262xxx, bu7262sxxx (unless otherwise specified vdd=+3v, vss=0v, t a =25 ) parameter symbol temperature range limit unit conditions min typ max input offset voltage (note 22 , 23) v io 25 - 1 9 mv vdd=1.8 to 5.5v full range - - 10 input offset current (note 22) i io 25 - 1 - pa - input bias current (note 22) i b 25 - 1 - pa - supply current (note 23) i dd 25 - 550 1100 a r l = , all op-amps a v =0db, in+=1.5v full range - - 1200 maximum output voltage(high) v oh 25 vdd-0.1 - - v r l =10k maximum output voltage(low) v ol 25 - - vss+0.1 v r l =10k large signal voltage gain a v 25 70 95 - db r l =10k input common-mode voltage range v icm 25 0 - 3 v vss - vdd common-mode rejection ratio cmrr 25 45 60 - db - power supply rejection ratio psrr 25 60 80 - db - output source current (note 24) i source 25 4 10 - ma out=vdd-0.4v output sink current (note 24) i sink 25 5 12 - ma out=vss+0.4v slew rate sr 25 - 1.1 - v/s c l =25pf gain bandwidth gbw 25 - 2 - mhz c l =25pf, a v =40db phase margin 25 - 50 - deg c l =25pf, a v =40db total harmonic distortion + noise thd+n 25 - 0.05 - % out=0.8v p-p , f=1khz channel separation cs 25 - 100 - db a v =40db, out=1vrms (note 22) absolute value (note 23) full range: bu7262: t a =- 40 to +85 bu7262s: t a =- 40 to +105 (note 24) under the high temperature environment, consider the power dissipation of ic when selecting the output current. when the terminal short circuits are continuously output, the output curre nt is reduced to climb to the temperature inside ic. downloaded from: http:///
datasheet www.rohm.com tsz02201-0rar0g200230-1-2 ? 201 3 rohm co., ltd. all rights reserved. 8/ 44 03.dec.2014 rev.004 tsz22111 ? 15 ? 001 bu7261g bu7261sg bu7262xxx bu7262sxxx bu7264 xx bu7264sxx electrical characteristics - continued bu7264xx, bu7264sxx (u nless otherwise specified vdd=+3v, vss=0v, t a =25 ) parameter symbol temperature range limit unit conditions min typ max input offset voltage (note 25 , 26) v io 25 - 1 9 mv vdd=1.8 to 5.5v full range - - 10 input offset current (note 25) i io 25 - 1 - pa - input bias current (note 25) i b 25 - 1 - pa - supply current (note 26) i dd 25 - 1100 2300 a r l = , all op-amps a v =0db, in+=1.5v full range - - 2800 maximum output voltage(high) v oh 25 vdd-0.1 - - v r l =10k maximum output voltage(low) v ol 25 - - vss+0.1 v r l =10k large signal voltage gain a v 25 70 95 - db r l =10k input common-mode voltage range v icm 25 0 - 3 v vss - vdd common-mode rejection ratio cmrr 25 45 60 - db - power supply rejection ratio psrr 25 60 80 - db - output source current (note 27) i source 25 4 10 - ma out=vdd-0.4v output sink current (note 27) i sink 25 5 12 - ma out=vss+0. 4v slew rate sr 25 - 1.1 - v/s c l =25pf gain bandwidth gbw 25 - 2 - mhz c l =25pf, a v =40db phase margin 25 - 50 - deg c l =25pf, a v =40db total harmonic distortion + noise thd+n 25 - 0.05 - % out=0.8v p-p , f=1khz channel separation cs 25 - 100 - db a v =40db, out=1vrms (note 25) absolute value (note 26) full range: bu7264 : t a =- 40 to +85 bu7264s: t a =- 40 to +105 (note 27) under the high temperature environment, consider the power d issipation of ic when selecting the output current. when the terminal short circuits are continuously output, the output curr ent is reduced to climb to the temperature inside ic. downloaded from: http:///
datasheet www.rohm.com tsz02201-0rar0g200230-1-2 ? 201 3 rohm co., ltd. all rights reserved. 9/ 44 03.dec.2014 rev.004 tsz22111 ? 15 ? 001 bu7261g bu7261sg bu7262xxx bu7262sxxx bu7264 xx bu7264sxx description of electrical characteristics described below are descriptions of the relevant electrical terms used in this datasheet. items and symbols used a re also shown. note that item name and symbol and their meaning may differ from those on another manufacturers document or general document. 1. absolute maximum ratings absolute maximum rating items indicate the condition which must not be exceeded. application of voltage i n excess of absolute maximum rating or use out of absolute maximum rated temperature environment may cause deterioration of characteristics. (1) supply voltage (vdd/vss) indicates the maximum voltage that can be applied betw een the vdd terminal and vss terminal without deterioration or destruction of characteristics of internal circuit. (2) differential input voltage (v id ) indicates the maximum voltage that can be applied between non-inverting and inverting terminals without damaging the ic. (3) input common-mode voltage range (v icm ) indicates the maximum voltage that can be applied to the non-inverting and inverting terminals without deteriorati on or destruction of electrical characteristics. input common-mode voltage range of the maximum ratings do es not assure normal operation of ic. for normal operation, use t he ic within the input common-mode voltage range ch aracteristics. (4) power dissipation (p d ) indicates the power that can be consumed by the ic when mounted on a specific board at the ambient tem perature 25 (normal temperature). as for package product, p d is determined by the temperature that can be permitted by the ic in the package (maximum junction temperature) and the thermal resis tance of the package. 2. electrical characteristics (1) input offset voltage (v io ) indicates the voltage difference between non-inverting te rminal and inverting terminals. it can be translated into th e input voltage difference required for setting the output volt age at 0 v. (2) input offset current (i io ) indicates the difference of input bias current between the non-inv erting and inverting terminals. (3) input bias current (i b ) indicates the current that flows into or out of the input termi nal. it is defined by the average of input bias currents at the non-inverting and inverting terminals. (4) supply current (i dd ) indicates the current that flows within the ic under specified no-loa d conditions. (5) maximum output voltage(high) / maximum output voltage(low) (v oh /v ol ) indicates the voltage range of the output under specified load condition. it is typically divided into maximum ou tput voltage h igh and low. maximum output voltage high indicates the uppe r limit of output voltage. maximum output v oltage low indicates the lower limit. (6) large signal voltage gain (a v ) indicates the amplifying rate (gain) of output voltage agains t the voltage difference between non-inverting terminal and inverting terminal. it is normally the amplifying rate (gain) w ith reference to dc voltage. av = (output voltage) / (differential input voltage ) (7) input common-mode voltage range (v icm ) indicates the input voltage range where ic normally operates. (8) common-mode rejection ratio (cmrr) indicates the ratio of fluctuation of input offset voltage wh en the input common mode voltage is changed. it is normally the fluctuation of dc. cmrr = (change of input common-mode voltage)/(input offset fluctua tion) (9) power supply rejection ratio (psrr) indicates the ratio of fluctuation of input offset voltage when supply voltage is changed. it is normally the fluctuation of dc. psrr = (change of power supply voltage)/(input offset fluctuation) (1 0) output source current / output sink current (i source /i sink ) the maximum current that can be output under specific outpu t conditions, it is divided into output source current and output sink current. the output source current indicates the current flowing out of the ic, and the output sink current the current flowing into the ic. (11) slew rate (sr) indicates the ratio of the change in output voltage with time when a step input signal is applied. (12) gain bandwidth (gbw) the product of the open-loop voltage gain and the frequency at which the voltage gain decreases 6db/octave. downloaded from: http:///
datasheet www.rohm.com tsz02201-0rar0g200230-1-2 ? 201 3 rohm co., ltd. all rights reserved. 10 / 44 03.dec.2014 rev.004 tsz22111 ? 15 ? 001 bu7261g bu7261sg bu7262xxx bu7262sxxx bu7264 xx bu7264sxx (1 3) phase margin ( ) indicates the margin of phase from 180 degree phase lag at uni ty gain frequency. (14) total harmonic distortion + noise (thd+n) indicates the fluctuation of input offset voltage or that of out put voltage with reference to the change of output voltage of driven channel. (1 5) channel separation (cs) indicates the fluctuation in the output voltage of the driv en channel with reference to the change of output voltage of the channel which is not driven. downloaded from: http:///
datasheet www.rohm.com tsz02201-0rar0g200230-1-2 ? 201 3 rohm co., ltd. all rights reserved. 11 / 44 03.dec.2014 rev.004 tsz22111 ? 15 ? 001 bu7261g bu7261sg bu7262xxx bu7262sxxx bu7264 xx bu7264sxx 0.0 0.2 0.4 0.6 0.8 0 25 50 75 100 125 ambient temperature [c] power dissipation [w] typical performance curves bu72 61 g, bu7261 sg (*)the above characteristics are measurements of typical s ample, they are not guaranteed. bu7261g: - 40 to +85 bu7261sg: - 40 to +105 figure 4. supply current vs supply voltage figure 5. supply current vs ambient temperature figure 2. power dissipation vs ambient temperature (derating curve) figure 3. power dissipation vs ambient temperature (derating curve) 0 200 400 600 800 1000 1 2 3 4 5 6 supply voltage [v] supply current [a] - 40 c 25 c 85 c 105 c 0 200 400 600 800 1000 -50 -25 0 25 50 75 100 125 ambient temperature [c] supply current [a] 1.8v 5.5v 3.0v 0.0 0.2 0.4 0.6 0.8 0 25 50 75 100 125 ambient temperature [c] power dissipation [w] bu7261g 85 105 bu7261sg downloaded from: http:///
datasheet www.rohm.com tsz02201-0rar0g200230-1-2 ? 201 3 rohm co., ltd. all rights reserved. 12 / 44 03.dec.2014 rev.004 tsz22111 ? 15 ? 001 bu7261g bu7261sg bu7262xxx bu7262sxxx bu7264 xx bu7264sxx typical performance curves - continued bu7261g, bu7261 sg (*)the above characteristics are measurements of typical s ample, they are not guaranteed. bu7261g: - 40 to +85 bu7261sg: - 40 to +105 figure 6. maximum output voltage (high) vs supply voltage (r l =10k) figure 7. maximum output voltage (high) vs ambient temperature (r l =10k) figure 8. maximum output voltage (low) vs supply voltage (r l =10k) figure 9. maximum output voltage (low) vs ambient temperature (r l =10k) 0 1 2 3 4 5 6 1 2 3 4 5 6 supply voltage [v] maximum output voltage (high) [v] - 40 c 25 c 85 c 105 c 10 0 1 2 3 4 5 6 -50 -25 0 25 50 75 100 125 ambient temperature [c] maximum output voltage (high) [v] 1.8v 5.5v 3.0v 0 5 10 15 20 1 2 3 4 5 6 supply voltage [v] maximum output voltage (low) [mv] 0 5 10 15 20 -50 -25 0 25 50 75 100 125 ambient temperature [c] maximum output voltage (low) [mv] - 40 c 25 c 85 c 105 c 1.8v 5.5v 3.0v downloaded from: http:///
datasheet www.rohm.com tsz02201-0rar0g200230-1-2 ? 201 3 rohm co., ltd. all rights reserved. 13 / 44 03.dec.2014 rev.004 tsz22111 ? 15 ? 001 bu7261g bu7261sg bu7262xxx bu7262sxxx bu7264 xx bu7264sxx typical performance curves - continued bu7261g, bu7261 sg (*)the above characteristics are measurements of typical s ample, they are not guaranteed. bu7261g: - 40 to +85 bu7261sg: - 40 to +105 figure 10 . output source current vs output voltage (vdd=3v) figure 11 . output source current vs ambient temperature (out=vdd-0.4v) figure 12 . output sink current vs output voltage (vdd=3v) figure 13 . output sink current vs ambient temperature (out=vss+0.4v) 0 10 20 30 40 50 0.0 0.5 1.0 1.5 2.0 2.5 3.0 output voltage [v] output source current [ma] 0 20 40 60 80 0.0 0.5 1.0 1.5 2.0 2.5 3.0 output voltage [v] output sink current [ma] - 40 c 25 c 85 c 105 c - 40 c 25 c 85 c 105 c 0 5 10 15 20 -50 -25 0 25 50 75 100 125 ambient temperature [c] output source current [ma] 0 10 20 30 40 -50 -25 0 25 50 75 100 125 ambient temperature [c] output sink current [ma] 1.8v 5.5v 3.0v 5.5v 1.8v 3.0v downloaded from: http:///
datasheet www.rohm.com tsz02201-0rar0g200230-1-2 ? 201 3 rohm co., ltd. all rights reserved. 14 / 44 03.dec.2014 rev.004 tsz22111 ? 15 ? 001 bu7261g bu7261sg bu7262xxx bu7262sxxx bu7264 xx bu7264sxx typical performance curves - continued bu7261g, bu7261 sg (*)the above characteristics are measurements of typical s ample, they are not guaranteed. bu7261g: - 40 to +85 bu7261sg: - 40 to +105 figure 16 . input offset voltage vs input voltage (vdd=3v) -10.0 -7.5 -5.0 -2.5 0.0 2.5 5.0 7.5 10.0 1 2 3 4 5 6 supply voltage [v] input offset voltage [mv] -10.0 -7.5 -5.0 -2.5 0.0 2.5 5.0 7.5 10.0 -50 -25 0 25 50 75 100 125 ambient temperature [c] input offset voltage [mv] figure 1 4. input offset voltage vs supply voltage (v icm =vdd, e k =-vdd/2) figure 1 5. input offset voltage vs ambient temperature (v icm =vdd, e k =-vdd/2) - 40 c 25 c 85 c 105 c 5.5v 1.8v 3.0v 60 80 100 120 140 160 1 2 3 4 5 6 supply voltage [v] large signal voltage gain [db] figure 1 7. large signal voltage gain vs supply voltage 40 c 25 c 85 c 105 c -10.0 -7.5 -5.0 -2.5 0.0 2.5 5.0 7.5 10.0 -1 0 1 2 3 4 input voltage [v] input offset voltage [mv] -40c 25c 85c 10 5c downloaded from: http:///
datasheet www.rohm.com tsz02201-0rar0g200230-1-2 ? 201 3 rohm co., ltd. all rights reserved. 15 / 44 03.dec.2014 rev.004 tsz22111 ? 15 ? 001 bu7261g bu7261sg bu7262xxx bu7262sxxx bu7264 xx bu7264sxx typical performance curves - continued bu7261g, bu7261 sg (*)the above characteristics are measurements of typical s ample, they are not guaranteed. bu7261g: - 40 to +85 bu7261sg: - 40 to +105 60 80 100 120 140 160 -50 -25 0 25 50 75 100 125 ambient temperature [c] large signal voltage gain [db] 0 20 40 60 80 100 120 1 2 3 4 5 6 supply voltage [v] common mode rejection ratio [db] 0 20 40 60 80 100 120 -50 -25 0 25 50 75 100 125 ambient temperature [c] common mode rejection ratio [db] 0 20 40 60 80 100 120 140 -50 -25 0 25 50 75 100 125 ambient temperature [c] power supply rejection ratio [db] figure 1 8. large signal voltage gain vs ambient temperature figure 1 9. common mode rejection ratio vs supply voltage figure 20. common mode rejection ratio vs ambient temperature figure 21. power supply rejection ratio vs ambient temperature 5.5v 1.8v 3.0v - 40 c 25 c 85 c 105 c 5.5v 1.8v 3.0v downloaded from: http:///
datasheet www.rohm.com tsz02201-0rar0g200230-1-2 ? 201 3 rohm co., ltd. all rights reserved. 16 / 44 03.dec.2014 rev.004 tsz22111 ? 15 ? 001 bu7261g bu7261sg bu7262xxx bu7262sxxx bu7264 xx bu7264sxx typical performance curves - continued bu7261g, bu7261 sg (*)the above characteristics are measurements of typical s ample, they are not guaranteed. bu7261g: - 40 to +85 bu7261sg: - 40 to +105 0 1 2 3 4 5 6 -50 -25 0 25 50 75 100 125 ambient temperature [c] slew rate l-h [v/s] 0.0 0.5 1.0 1.5 2.0 2.5 3.0 -50 -25 0 25 50 75 100 125 ambient temperature [c] slew rate h-l [v/s] figure 22. slew rate l-h vs ambient temperature 0 20 40 60 80 100 frequency [hz] voltage gain [db] 0 40 80 120 160 200 phase [deg] figure 23. slew rate h-l vs ambient temperature figure 24. voltage gain ? phase vs frequency 5.5v 1.8v 3.0v 5.5v 1.8v 3.0v phase gain 10 2 10 3 10 4 10 5 10 6 10 7 10 8 downloaded from: http:///
datasheet www.rohm.com tsz02201-0rar0g200230-1-2 ? 201 3 rohm co., ltd. all rights reserved. 17 / 44 03.dec.2014 rev.004 tsz22111 ? 15 ? 001 bu7261g bu7261sg bu7262xxx bu7262sxxx bu7264 xx bu7264sxx typical performance curves C continued bu7262 xxx , bu726 2s xxx (*)the above characteristics are measurements of typical s ample, they are not guaranteed. bu7262 xxx : - 40 to + 85 bu7262s xxx : - 40 to + 105 0.0 0.2 0.4 0.6 0.8 0 25 50 75 100 125 ambient temperature [c] power dissipation [w] 0 400 800 1200 1600 2000 1 2 3 4 5 6 supply voltage [v] supply current [a] 0 300 600 900 1200 1500 -50 -25 0 25 50 75 100 125 ambient temperature [c] supply current [a] figure 25. power dissipation vs ambient temperature (derating curve) figure 26. power dissipation vs ambient temperature (derating curve) figure 27. supply current vs supply voltage figure 28. supply current vs ambient temperature bu7262f bu7262 fv m bu7262nux 0.0 0.2 0.4 0.6 0.8 0 25 50 75 100 125 ambient temperature [c] power dissipation [w] bu7262 sf bu7262sfvm bu7262s nux - 40 c 25 c 85 c 1 05 c 1.8v 5.5v 3.0v 85 10 5 downloaded from: http:///
datasheet www.rohm.com tsz02201-0rar0g200230-1-2 ? 201 3 rohm co., ltd. all rights reserved. 18 / 44 03.dec.2014 rev.004 tsz22111 ? 15 ? 001 bu7261g bu7261sg bu7262xxx bu7262sxxx bu7264 xx bu7264sxx typical performance curves C continued bu7262 xxx , bu726 2s xxx (*)the above characteristics are measurements of typical s ample, they are not guaranteed. bu7262 xxx : - 40 to + 85 bu726 2s xxx : - 40 to + 105 0 1 2 3 4 5 6 1 2 3 4 5 6 supply voltage [v] maximum output voltage (high) [v] 0 1 2 3 4 5 6 -50 -25 0 25 50 75 100 125 ambient temperature [c] maximum output voltage (high) [v] 0 5 10 15 20 1 2 3 4 5 6 supply voltage [v] maximum output voltage (low) [mv] 0 5 10 15 20 -50 -25 0 25 50 75 100 125 ambient temperature [c] maximum output voltage (low) [mv] figure 29. maximum output voltage (high) vs supply voltage (r l =10k) figure 30. maximum output voltage (high) vs ambient temperature (r l =10k) figure 31. maximum output voltage (low) vs supply voltage (r l =10k) figure 32. maximum output voltage (low) vs ambient temperature (r l =10k ) - 40 c 25 c 85 c 105 c 10 1.8v 5.5v 3.0v - 40 c 25 c 85 c 105 c 1.8v 5.5v 3.0v downloaded from: http:///
datasheet www.rohm.com tsz02201-0rar0g200230-1-2 ? 201 3 rohm co., ltd. all rights reserved. 19 / 44 03.dec.2014 rev.004 tsz22111 ? 15 ? 001 bu7261g bu7261sg bu7262xxx bu7262sxxx bu7264 xx bu7264sxx figure 34. output source current vs ambient temperature (out=vdd-0.4v) typical performance curves C continued bu7262 xxx , bu726 2s xxx (*)the above characteristics are measurements of typical s ample, they a re not guaranteed. bu7262 xxx : - 40 to + 85 bu7262s xxx : - 40 to + 105 0 10 20 30 40 50 0.0 0.5 1.0 1.5 2.0 2.5 3.0 output voltage [v] output source current [ma] figure 33. output source current vs output voltage (vdd=3v) figure 35. output sink current vs output voltage (vdd=3v) figure 36. output sink current vs ambient temperature (out=vss+0.4v) - 40 c 25 c 85 c 105 c 0 5 10 15 20 -50 -25 0 25 50 75 100 125 ambient temperature [c] output source current [ma] 0 20 40 60 80 0.0 0.5 1.0 1.5 2.0 2.5 3.0 output voltage [v] output sink current [ma] - 40 c 25 c 85 c 105 c 0 10 20 30 40 -50 -25 0 25 50 75 100 125 ambient temperature [c] output sink current [ma] 5.5v 1.8v 3.0v 1.8v 5.5v 3.0v downloaded from: http:///
datasheet www.rohm.com tsz02201-0rar0g200230-1-2 ? 201 3 rohm co., ltd. all rights reserved. 20 / 44 03.dec.2014 rev.004 tsz22111 ? 15 ? 001 bu7261g bu7261sg bu7262xxx bu7262sxxx bu7264 xx bu7264sxx typical performance curves C continued bu7262 xxx , bu726 2s xxx (*)the above characteristics are measurements of typical s ample, they are not guaranteed. bu7262 xxx : - 40 to + 85 bu7262s xxx : - 40 to + 105 -10.0 -7.5 -5.0 -2.5 0.0 2.5 5.0 7.5 10.0 1 2 3 4 5 6 supply voltage [v] input offset voltage [mv] -10.0 -7.5 -5.0 -2.5 0.0 2.5 5.0 7.5 10.0 -50 -25 0 25 50 75 100 125 ambient temperature [c] input offset voltage [mv] -10.0 -7.5 -5.0 -2.5 0.0 2.5 5.0 7.5 10.0 -1 0 1 2 3 4 input voltage [v] input offset voltage [mv] figure 37. input offset voltage vs supply voltage (v icm =vdd, e k =-vdd/2) figure 38. input offset voltage vs ambient temperature (v icm =vdd, e k =-vdd/2) figure 39. input offset voltage vs input voltage (vdd=3v) figure 40. large signal voltage gain vs supply voltage - 40 c 25 c 85 c 105 c 5.5v 1.8v 3.0v - 40 c 25 c 85 c 105 c 60 80 100 120 140 160 1 2 3 4 5 6 supply voltage [v] large signal voltage gain [db] 40 c 25 c 85 c 105 c downloaded from: http:///
datasheet www.rohm.com tsz02201-0rar0g200230-1-2 ? 201 3 rohm co., ltd. all rights reserved. 21 / 44 03.dec.2014 rev.004 tsz22111 ? 15 ? 001 bu7261g bu7261sg bu7262xxx bu7262sxxx bu7264 xx bu7264sxx typical performance curves C continued bu7262 xxx , bu726 2s xxx (*)the above characteristics are measurements of typical s ample, they are not guaranteed. bu7262 xxx : - 40 to + 85 bu7262s xxx : - 40 to + 105 figure 41. large signal voltage gain vs ambient temperature figure 42. common mode rejection ratio vs supply voltage (vdd=3v) figure 43. common mode rejection ratio vs ambient temperature (vdd=3v) figu re 44. power supply rejection ratio vs ambient temperature 0 20 40 60 80 100 120 140 -50 -25 0 25 50 75 100 125 ambient temperature [c] power supply rejection ratio [db] 60 80 100 120 140 160 -50 -25 0 25 50 75 100 125 ambient temperature [c] large signal voltage gain [db] 0 20 40 60 80 100 120 1 2 3 4 5 6 supply voltage [v] common mode rejection ratio [db] 5.5v 1.8v 3.0v - 40 c 25 c 85 c 105 c 0 20 40 60 80 100 120 -50 -25 0 25 50 75 100 125 ambient temperature [c] common mode rejection ratio [db] 5.5v 1.8v 3.0v downloaded from: http:///
datasheet www.rohm.com tsz02201-0rar0g200230-1-2 ? 201 3 rohm co., ltd. all rights reserved. 22 / 44 03.dec.2014 rev.004 tsz22111 ? 15 ? 001 bu7261g bu7261sg bu7262xxx bu7262sxxx bu7264 xx bu7264sxx typical performance curves C continued bu7262 xxx , bu726 2s xxx (*)the above characteristics are measurements of typical s ample, they are not guaranteed. bu7262 xxx : - 40 to + 85 bu7262s xxx : - 40 to + 105 0 1 2 3 4 5 6 -50 -25 0 25 50 75 100 125 ambient temperature [c] slew rate l-h [v/s] figure 45. slew rate l-h vs ambient temperature 0.0 0.5 1.0 1.5 2.0 2.5 3.0 -50 -25 0 25 50 75 100 125 ambient temperature [c] slew rate h-l [v/s] figure 46. slew rate h-l vs ambient temperature figu re 47. voltage gain ? phase vs frequency 5.5v 1.8v 3.0v 5.5v 1.8v 3.0v 0 20 40 60 80 100 frequency [hz] voltage gain [db] 0 40 80 120 160 200 phase [deg] 10 2 10 3 10 4 10 5 10 6 10 7 10 8 phase gain downloaded from: http:///
datasheet www.rohm.com tsz02201-0rar0g200230-1-2 ? 201 3 rohm co., ltd. all rights reserved. 23 / 44 03.dec.2014 rev.004 tsz22111 ? 15 ? 001 bu7261g bu7261sg bu7262xxx bu7262sxxx bu7264 xx bu7264sxx typical performance curves C continued bu7264xx , bu726 4s xx (*)the above characteristics are measurements of typical s ample, they are not guaranteed. bu7264 xx : - 40 to +85 bu7264s xx : - 40 to +105 figure 48 . power dissipation vs ambient temperature (derating curve) figure 50 . supply current vs supply voltage figure 51. supply current vs ambient temperature figure 49 . power dissipation vs ambient temperature (derating curve) 0.0 0.2 0.4 0.6 0.8 0 25 50 75 100 125 ambient temperature [c] power dissipation [w] 0 500 1000 1500 2000 2500 3000 0 1 2 3 4 5 6 supply voltage [v] supply current [a] 0 500 1000 1500 2000 2500 3000 -50 -25 0 25 50 75 100 125 ambient temperature [c] supply current [a] bu7264f 0.0 0.2 0.4 0.6 0.8 0 25 50 75 100 125 ambient temperature [c] power dissipation [w] - 40 c 25 c 85 c 1 05 c 1.8v 5.5v 3.0v 85 10 5 bu7264fv bu726 4s f bu726 4s fv downloaded from: http:///
datasheet www.rohm.com tsz02201-0rar0g200230-1-2 ? 201 3 rohm co., ltd. all rights reserved. 24 / 44 03.dec.2014 rev.004 tsz22111 ? 15 ? 001 bu7261g bu7261sg bu7262xxx bu7262sxxx bu7264 xx bu7264sxx typical performance curves C continued bu7264 xx , bu726 4s xx (*)the above characteristics are measurements of typical s ample, they are not guaranteed. bu7264 xx : - 40 to +85 bu7264s xx : - 40 to +105 0 1 2 3 4 5 6 1 2 3 4 5 6 supply voltage [v] maximum output voltage (high) [v] 0 1 2 3 4 5 6 -50 -25 0 25 50 75 100 125 ambient temperature [c] maximum output voltage (high) [v] 0 5 10 15 20 1 2 3 4 5 6 supply voltage [v] maximum output voltage (low) [mv] figure 52 . maximum output voltage (high) vs supply voltage (r l =10k) figure 53 . maximum output voltage (high) vs ambient temperature (r l =10k) figure 54 . maximum output voltage (low) vs supply voltage (r l =10k) figure 55 . maximum output voltage (low) vs ambient temperature (r l =10k) - 40 c 25 c 85 c 105 c 10 1.8v 5.5v 3.0v - 40 c 25 c 85 c 105 c 0 5 10 15 20 -50 -25 0 25 50 75 100 125 ambient temperature [c] maximum output voltage (low) [mv] 1.8v 5.5v 3.0v downloaded from: http:///
datasheet www.rohm.com tsz02201-0rar0g200230-1-2 ? 201 3 rohm co., ltd. all rights reserved. 25 / 44 03.dec.2014 rev.004 tsz22111 ? 15 ? 001 bu7261g bu7261sg bu7262xxx bu7262sxxx bu7264 xx bu7264sxx figure 57 . output source current vs ambient temperature (out=vdd-0.4v) typical performance curves C continued bu7264 xx , bu726 4s xx (*)the above characteristics are measurements of typical s ample, they are not guaranteed. bu7264 xx : - 40 to +85 bu7264s xx : - 40 to +105 0 5 10 15 20 -50 -25 0 25 50 75 100 125 ambient temperature [c] output source current [ma] 0 20 40 60 80 0.0 0.5 1.0 1.5 2.0 2.5 3.0 output voltage [v] output sink current [ma] 0 10 20 30 40 -50 -25 0 25 50 75 100 125 ambient temperature [c] output sink current [ma] figure 56 . output source current vs output voltage (vdd=3v) figure 58. output sink current vs output voltage (vdd=3v) figure 59 . output sink current vs ambient temperature (out=vss+0.4v) 1.8v 5.5v 3.0v - 40 c 25 c 85 c 105 c 5.5v 1.8v 3.0v 0 10 20 30 40 50 0.0 0.5 1.0 1.5 2.0 2.5 3.0 output voltage [v] output source current [ma] - 40 c 25 c 85 c 105 c downloaded from: http:///
datasheet www.rohm.com tsz02201-0rar0g200230-1-2 ? 201 3 rohm co., ltd. all rights reserved. 26 / 44 03.dec.2014 rev.004 tsz22111 ? 15 ? 001 bu7261g bu7261sg bu7262xxx bu7262sxxx bu7264 xx bu7264sxx typical performance curves C continued bu7264 xx , bu726 4s xx (*)the above characteristics are measurements of typical s ample, they are not guaranteed. bu7264 xx : - 40 to +85 bu7264s xx : - 40 to +105 -10.0 -7.5 -5.0 -2.5 0.0 2.5 5.0 7.5 10.0 1 2 3 4 5 6 supply voltage [v] input offset voltage [mv] -10.0 -7.5 -5.0 -2.5 0.0 2.5 5.0 7.5 10.0 -50 -25 0 25 50 75 100 125 ambient temperature [c] input offset voltage [mv] -10.0 -7.5 -5.0 -2.5 0.0 2.5 5.0 7.5 10.0 -1 0 1 2 3 4 input voltage [v] input offset voltage [mv] figure 60 . input offset voltage vs supply voltage (v icm =vdd, e k =-vdd/2) figure 61 . input offset voltage vs ambient temperature (v icm =vdd, e k =-vdd/2) figure 62 . input offset voltage vs input voltage (vdd=3v) figure 63 . large signal voltage gain vs supply voltage - 40 c 25 c 85 c 105 c 5.5v 1.8v 3.0v - 40 c 25 c 85 c 105 c 60 80 100 120 140 160 1 2 3 4 5 6 supply voltage [v] large signal voltage gain [db] 40 c 25 c 85 c 105 c downloaded from: http:///
datasheet www.rohm.com tsz02201-0rar0g200230-1-2 ? 201 3 rohm co., ltd. all rights reserved. 27 / 44 03.dec.2014 rev.004 tsz22111 ? 15 ? 001 bu7261g bu7261sg bu7262xxx bu7262sxxx bu7264 xx bu7264sxx typical performance curves C continued bu7264 xx , bu726 4s xx (*)the above characteristics are measurements of typical s ample, they are not guaranteed. bu7264 xx : - 40 to +85 bu7264s xx : - 40 to +105 60 80 100 120 140 160 -50 -25 0 25 50 75 100 125 ambient temperature [c] large signal voltage gain [db] 0 20 40 60 80 100 120 1 2 3 4 5 6 supply voltage [v] common mode rejection ratio [db] 0 20 40 60 80 100 120 -50 -25 0 25 50 75 100 125 ambient temperature [c] common mode rejection ratio [db] 0 20 40 60 80 100 120 -50 -25 0 25 50 75 100 125 ambient temperature [c] power supply rejection ratio [db] figure 64 . large signal voltage gain vs ambient temperature figure 65 . common mode rejection ratio vs supply voltage (vdd=3v) figure 66 . common mode rejection ratio vs ambient temperature (vdd=3v) figure 67 . power supply rejection ratio vs ambient temperature 5.5v 1.8v 3.0v 5.5v 1.8v 3.0v - 40 c 25 c 85 c 105 c downloaded from: http:///
datasheet www.rohm.com tsz02201-0rar0g200230-1-2 ? 201 3 rohm co., ltd. all rights reserved. 28 / 44 03.dec.2014 rev.004 tsz22111 ? 15 ? 001 bu7261g bu7261sg bu7262xxx bu7262sxxx bu7264 xx bu7264sxx typical performance curves C continued bu7264 xx , bu726 4s xx (*)the above characteristics are measurements of typical s ample, they are not guaranteed. bu7264 xx : - 40 to +85 bu7264s xx : - 40 to +105 0 1 2 3 4 5 6 -50 -25 0 25 50 75 100 125 ambient temperature [c] slew rate l-h [v/s] figure 68 . slew rate l-h vs ambient temperature 0.0 0.5 1.0 1.5 2.0 2.5 3.0 -50 -25 0 25 50 75 100 125 ambient temperature [c] slew rate h-l [v/s] figure 69 . slew rate h-l vs ambient temperature figure 70. voltage gain ? phase vs frequency 5.5v 1.8v 3.0v 5.5v 1.8v 3.0v 0 20 40 60 80 100 frequency [hz] voltage gain [db] 0 40 80 120 160 200 phase [deg] 10 2 10 3 10 4 10 5 10 6 10 7 10 8 phase gain downloaded from: http:///
datasheet www.rohm.com tsz02201-0rar0g200230-1-2 ? 201 3 rohm co., ltd. all rights reserved. 29 / 44 03.dec.2014 rev.004 tsz22111 ? 15 ? 001 bu7261g bu7261sg bu7262xxx bu7262sxxx bu7264 xx bu7264sxx application information null method condition for test circuit 1 vdd, vss, e k , v icm unit: v parameter v f s1 s2 s3 vdd vss e k v icm calculation input offset voltage v f1 on on off 3 0 -1.5 3 1 large signal voltage gain v f2 on on on 3 0 -0.5 1.5 2 v f3 -2.5 common-mode rejection ratio (input common-mode voltage r ange) v f4 on on off 3 0 -1.5 0 3 v f5 3 power supply rejection ratio v f6 on on off 1.8 0 -0.9 0 4 v f7 5.5 - calculation - 1. input offset voltage (v io ) 2. large signal voltage g ain (a v ) 3. common-mode rejection ratio (cmrr) 4. power supply rejection ratio (psrr) v io |v f1 | = 1+r f /r s [v] av |v f2 -v f3 | = e k (1+r f /r s ) [db] 20log cmrr |v f4 - v f5 | = v icm (1+r f /r s ) [db] 20log psrr |v f6 - v f7 | = vdd (1+ r f /r s ) [db] 20log figure 71 . test circuit 1 (o ne channel o nly ) lot number 1pin mark v icm r s =50 r s =50 r f =5 0k r i = 1m r i = 1m 0.015f 0.015f sw1 sw2 50k sw3 r l v rl 0.1f e k 500k 500k 1000pf v f 0. 0 1f 15v - 15v vdd vss vo v null dut downloaded from: http:///
datasheet www.rohm.com tsz02201-0rar0g200230-1-2 ? 201 3 rohm co., ltd. all rights reserved. 30 / 44 03.dec.2014 rev.004 tsz22111 ? 15 ? 001 bu7261g bu7261sg bu7262xxx bu7262sxxx bu7264 xx bu7264sxx application information - continued switch condition for test circuit 2 sw no. sw1 sw2 sw3 sw4 sw5 s w6 sw7 sw8 sw9 sw10 sw11 sw12 supply current off off on off on off off off off off off off maximum output voltage r l =10k off on off off on off off on off off on off output current off on off off on off off off off on off off slew rate off off on off o ff off on off on off off on gain bandwidth on off off on on off off off on off off on figure 72 . test circuit 2 (each channel) figure 74 . test circuit 3 (channel separation) cs=20log 100out1 out2 figure 73 . slew rate input and output wave input voltage output voltage input wave output wave t 3 v p - p 3 v 0 v t t 3 v 0 v v 10% 9 0% sr = v / t sw 3 sw1 sw2 sw9 sw10 sw11 sw8 sw5 sw6 sw7 c l sw12 sw4 r1 =1k r2=100k r l vss vdd vo in - in+ r2=100k r1=1k vdd vss out1 in r1//r2 out2 r2=100k r1=1 k vdd vss r1//r2 downloaded from: http:///
datasheet www.rohm.com tsz02201-0rar0g200230-1-2 ? 201 3 rohm co., ltd. all rights reserved. 31 / 44 03.dec.2014 rev.004 tsz22111 ? 15 ? 001 bu7261g bu7261sg bu7262xxx bu7262sxxx bu7264 xx bu7264sxx examples of circuit voltage follower inverting amplifier non-inverting amplifier figure 76 . inverting amplifier circuit figure 77 . non-inverting amplifier circuit figure 75 . voltage follower circuit voltage gain is 0db. using this circuit, the output voltage (out) is configured to be equal to the input voltage (in). this circuit also stabilizes the output voltage (out) due to high input impedance and low output impedance. computation for output voltage (out) is shown below. out=in for inverting amplifier, input voltage (in) is amplified by a voltage gain and depends on the ratio of r1 and r2. the out- of -phase output voltage is shown in the next expression out=-(r2/r1) ? in this circuit has input impedance equal to r1. for non-inverting amplifier, input voltage (in) is amplified by a voltage gain, which depends on the ratio of r1 and r2. the output voltage (out) is in-phase with the input voltage (in) and is shown in the next expression. out=(1 + r2/r1) ? in effectively, this circuit has high input impedance since its input side is the same as that of the operational amplifier. vss out in vdd r 2 r 1 vss in out vdd vss r 2 vdd in out r 1 downloaded from: http:///
datasheet www.rohm.com tsz02201-0rar0g200230-1-2 ? 201 3 rohm co., ltd. all rights reserved. 32 / 44 03.dec.2014 rev.004 tsz22111 ? 15 ? 001 bu7261g bu7261sg bu7262xxx bu7262sxxx bu7264 xx bu7264sxx power dissipation power dissipation (total loss) indicates the power that the ic can consume at t a =25c (normal temperature). as the ic consumes power, it heats up, causing its temperature to be higher than the ambient temperature. the allowable temperature that the ic can accept is limited. this depend s on the circuit configuration, manufacturing process, and consumable power. power dissipation is determined by the allowable tempera ture within the ic (maximum junction temperature) and the thermal resistance of the package used (heat dissipatio n capability). maximum junction temperature is typically eq ual to the maximum storage temperature. the heat generated through the c onsumption of power by the ic radiates from the mold resin or lead frame of the package. thermal resistance, represe nted by the symbol ja c/w, indicates this heat dissipation capability. similarly, the temperature of an ic inside its package can be estimated by thermal resistance. figure 78 (a) shows the model of the thermal resistance of a package. the equation below shows how to compute for the thermal resistance ( ja ), given the ambient temperature (t a ), maximum junction temperature (t jmax ), and power dissipation (p d ). ja = (t jmax t a ) / p d c/w the derating curve in figure 78 (b) indicates the power that the ic can consume with referenc e to ambient temperature. power consumption of the ic begins to attenuate at certain tem peratures. this gradient is determined by thermal resistance ( ja ), which depends on the chip size, power consumption, pack age, ambient temperature, package condition, wind velocity, etc. this may also vary even when the sam e of package is used. thermal reduction curve indicates a reference value measured at a specified condition. figure 78(c) to 78(h) shows an example of the derating curve for bu7261g, bu7261sg, bu7262xxx, bu7262sxxx , bu7264xx, bu7264sxx. (c)bu7 26 1g (d)bu7 26 1 sg 0.0 0.2 0.4 0.6 0.8 0 25 50 75 100 125 ambient temperature [c] power dissipation [w] 0.0 0.2 0.4 0.6 0.8 0 25 50 75 100 125 ambient temperature [c] power dissipation [w] bu7 26 1 g( note 28 ) bu7 26 1sg(note 28 ) 85 10 5 ja =( t jmax -t a )/ p d c /w ambient temperature t a [ c ] chip surface temperature t j [ c ] (a) thermal resistance 0 ambient temperature t a [ ? c] p2 p1 25 125 75 100 50 power dissipation of lsi [w] p dmax t jmax ja2 ja1 ja 2 < ja 1 (b) derating curve power dissipation of ic downloaded from: http:///
datasheet www.rohm.com tsz02201-0rar0g200230-1-2 ? 201 3 rohm co., ltd. all rights reserved. 33 / 44 03.dec.2014 rev.004 tsz22111 ? 15 ? 001 bu7261g bu7261sg bu7262xxx bu7262sxxx bu7264 xx bu7264sxx (note 28) (note 29) (note 30 ) (note 31 ) (note 32) (note 33) unit 5.4 5.5 4. 7 4.1 4.5 7.0 mw/ when using the unit above t a =25 , subtract the value above per celsius degree. power dissipation is the value when fr4 glass epoxy board 70mm70mm1.6mm (copper foil area less than 3 ) is mounted. figure 78 . thermal resistance and derating curve (e)bu7 26 2 f/fv m/nux (f)bu7 26 2sf/sfvm/snux 0.0 0.2 0.4 0.6 0.8 0 25 50 75 100 125 ambient temperature [c] power dissipation [w] 0.0 0.2 0.4 0.6 0.8 0 25 50 75 100 125 ambient temperature [c] power dissipation [w] bu7 26 2 f( note 29 ) bu7 26 2 fv m(note 30 ) bu7 26 2nux(note 31 ) bu7 26 2sf(note 29 ) bu7 26 2sfvm(note 30 ) bu7 26 2s nux (note 31 ) 85 10 5 (g)bu7 26 4 f/fv (h)bu7 26 4sf/sfv 0.0 0.2 0.4 0.6 0.8 0 25 50 75 100 125 ambient temperature [c] power dissipation [w] 0.0 0.2 0.4 0.6 0.8 0 25 50 75 100 125 ambient temperature [c] power dissipation [w] bu7 26 2 f( note 32 ) bu7 26 2fv(note 33 ) bu7 26 2sf(note 32 ) bu7 26 2sfv(note 33 ) 85 10 5 downloaded from: http:///
datasheet www.rohm.com tsz02201-0rar0g200230-1-2 ? 201 3 rohm co., ltd. all rights reserved. 34 / 44 03.dec.2014 rev.004 tsz22111 ? 15 ? 001 bu7261g bu7261sg bu7262xxx bu7262sxxx bu7264 xx bu7264sxx operational notes 1. reverse connection of power supply connecting the power supply in reverse polarity can damage the ic. take precautions against reverse polarity when connecting the power supply, such as mounting an extern al diode between the power supply and the ic s power supply pin s. 2. po wer supply lines design the pcb layout pattern to provide low impedance supply lines. separate the ground and supply lines of the digital and analog blocks to prevent noise in the groun d and supply lines of the digital block from affecting t he analog block. furthermore, connect a capacitor to ground at all power s upply pins . consider the effect of temperature and aging on the capacitance value when using electrolytic capa citors. 3. ground voltage ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. 4. ground wiring pattern when using both small-signal and large-current ground tra ces, the two ground traces should be routed separately but connected to a single ground at the reference point of the a pplication board to avoid fluctuations in the small-sign al ground caused by large currents. also ensure that the ground traces of external components do not cause variations on the ground voltage. the ground lines must be as short and thick as possible to reduce line impedance. 5. thermal consideration should by any chance the power dissipation rating be ex ceeded the rise in temperature of the chip may result in deterioration of the properties of the chip. the absolute max imum rating of the p d stated in this specification is when the ic is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. in case of exceeding this absolute maximum rating, increase the board size and copper area to prevent excee ding the p d rating. 6. recommended operating conditions these conditions re present a range within which the expected characteristics of the ic can be approximately obtained . the electrical characteristics are guaranteed under the condi tions of each parameter. 7. inrush current when power is first supplied to the ic, it is possible that the internal logic may be unstable and inrush current m ay flow instantaneously due to the internal powering sequenc e and delays, especially if the ic has more than one pow er supply. therefore, give special consideration to power coupl ing capacitance, power wiring, width of ground wiring, and routing of connections. 8. operation under strong electromagnetic field operating the ic in the presence of a strong electromagnetic field ma y cause the ic to malfunction. 9. testing on application boards when testing the ic on an application board, connecting a capacitor directly to a low-impedance output pin may subject the ic to stress. always discharge capacitors comp letely after each process or step. the ics power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. to prevent damage from static discharge, ground t he ic during assembly and use similar precautions during transport and storage. 10. inter-pin short and mounting errors ensure that the direction and position are correct when mounti ng the ic on the pcb. incorrect mounting may result in damaging the ic. avoid nearby pins being shorted to each o ther especially to ground, power supply and output pin . inter-pin shorts could be due to many reasons such as metal parti cles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during as sembly to name a few. 11. unused input pins input pin s of an ic are often connected to the gate of a mos transistor . the gate has extremely high impedance and extremely low capacitance. if left unconnected, the elec tric field from the outside can easily charge it. the smal l charge acquired in this way is enough to produce a signi ficant effect on the conduction through the transistor and cause unexpected operation of the ic. so unless otherwise spec ified, unused input pins should be connected to the power supply or ground line. downloaded from: http:///
datasheet www.rohm.com tsz02201-0rar0g200230-1-2 ? 201 3 rohm co., ltd. all rights reserved. 35 / 44 03.dec.2014 rev.004 tsz22111 ? 15 ? 001 bu7261g bu7261sg bu7262xxx bu7262sxxx bu7264 xx bu7264sxx operational notes C continued 12. regarding the input pin of the ic in the construction of this ic, p-n junctions are inevitably formed creating parasitic diodes or transistors. the operation of these parasitic elements can result in mutua l interference among circuits, operational faults, or physica l damage. therefore, conditions which cause these parasitic elements to operate, such as applying a voltage to an input pin lower than the ground voltage should be avoide d. furthermore, do not apply a voltage to the input pins whe n no power supply voltage is applied to the ic. even if the power suppl y voltage is applied, make sure that the input pin s have voltages within the values specified in the electrical chara cteristics of this ic. 13. unused circuits when there are unused op-amps, it is recommended that the y are connected as in figure 79, setting the non-inverting inp ut terminal to a potential within the input common mode voltage range (v icm ). 14. input voltage applying vdd+0.3v to the input terminal is possible without ca using deterioration of the electrical characteristics or destruction . however, this does not ensure normal circuit operation. please note that the circuit operates normally only when the input voltage is within the common mode input voltage range of the electric characteristi cs. 15. power supply(single/dual) the operational amplifier operates when the voltage sup plied is between vdd and vss. therefore, the single supply operational amplifiers can be used as dual supply operati onal amplifiers as well. 16. output capacitor if a large capacitor is connected between the output pin and v ss pin, current from the charged capacitor will flow into the output pin and may destroy the ic when the v dd pin is shorted to ground or pulled down to 0v. use a capacitor smaller than 0. 1uf between output pin and v ss pin . 17. oscillation by output capacitor please pay attention to the oscillation by output capacito r and in designing an application of negative feedback loop circuit with these ics. 18. latch up be careful of input voltage that exceed the vdd and vss. when cmo s device have sometimes occur latch up a nd protect the ic from abnormaly noise. 19. decupling capacitor insert the decupling capacitance between vdd and vss , for stable operation of operational amplifier. 20. radiation land the vson008x2030 package has a radiation land in the center of the back. please connect to vss potenital or don't connect to other terminal. figure 79 . example of application circuit for unused op-amp keep this potential in v icm vss vdd v icm downloaded from: http:///
datasheet www.rohm.com tsz02201-0rar0g200230-1-2 ? 201 3 rohm co., ltd. all rights reserved. 36 / 44 03.dec.2014 rev.004 tsz22111 ? 15 ? 001 bu7261g bu7261sg bu7262xxx bu7262sxxx bu7264 xx bu7264sxx marking diagrams product name package type marking bu7261 g ssop5 al bu7261s g ax bu7262 f sop8 7262 fvm msop8 nux vson008x2030 bu7262s f sop8 7262s fvm msop8 nux vson008x2030 bu7264 f sop14 bu7264f fv ssop-b14 7264 bu7264s f sop14 bu7264sf fv ssop-b14 7264s sop14(top view) part number marking lot number 1pin mark msop8(top view) part number marking lot number 1pin mark part number marking ssop5(top view) lot number vson008x2030 (top view) part number marking lot number 1pin mark ssop-b14(top view) part number marking lot number 1pin mark sop8(top view) part number marking lot number 1pin mark downloaded from: http:///
datasheet www.rohm.com tsz02201-0rar0g200230-1-2 ? 201 3 rohm co., ltd. all rights reserved. 37 / 44 03.dec.2014 rev.004 tsz22111 ? 15 ? 001 bu7261g bu7261sg bu7262xxx bu7262sxxx bu7264 xx bu7264sxx physical dimension, tape and reel information package name ssop5 downloaded from: http:///
datasheet www.rohm.com tsz02201-0rar0g200230-1-2 ? 201 3 rohm co., ltd. all rights reserved. 38 / 44 03.dec.2014 rev.004 tsz22111 ? 15 ? 001 bu7261g bu7261sg bu7262xxx bu7262sxxx bu7264 xx bu7264sxx physical dimension, tape and reel information - continued package name sop8 (unit : mm) pkg : sop8 drawing no. : ex112-5001-1 (max 5.35 (include.burr)) downloaded from: http:///
datasheet www.rohm.com tsz02201-0rar0g200230-1-2 ? 201 3 rohm co., ltd. all rights reserved. 39 / 44 03.dec.2014 rev.004 tsz22111 ? 15 ? 001 bu7261g bu7261sg bu7262xxx bu7262sxxx bu7264 xx bu7264sxx physical dimension, tape and reel information C continued package name sop14 (unit : mm) pkg : sop14 drawing no. : ex113-5001 (max 9.05 (include.burr)) downloaded from: http:///
datasheet www.rohm.com tsz02201-0rar0g200230-1-2 ? 201 3 rohm co., ltd. all rights reserved. 40 / 44 03.dec.2014 rev.004 tsz22111 ? 15 ? 001 bu7261g bu7261sg bu7262xxx bu7262sxxx bu7264 xx bu7264sxx physical dimension, tape and reel information C continued package name ssop-b14 downloaded from: http:///
datasheet www.rohm.com tsz02201-0rar0g200230-1-2 ? 201 3 rohm co., ltd. all rights reserved. 41 / 44 03.dec.2014 rev.004 tsz22111 ? 15 ? 001 bu7261g bu7261sg bu7262xxx bu7262sxxx bu7264 xx bu7264sxx physical dimension, tape and reel information - continued package name msop8 downloaded from: http:///
datasheet www.rohm.com tsz02201-0rar0g200230-1-2 ? 201 3 rohm co., ltd. all rights reserved. 42 / 44 03.dec.2014 rev.004 tsz22111 ? 15 ? 001 bu7261g bu7261sg bu7262xxx bu7262sxxx bu7264 xx bu7264sxx physical dimension, tape and reel information C continued package name vson008x2030 downloaded from: http:///
datasheet www.rohm.com tsz02201-0rar0g200230-1-2 ? 201 3 rohm co., ltd. all rights reserved. 43 / 44 03.dec.2014 rev.004 tsz22111 ? 15 ? 001 bu7261g bu7261sg bu7262xxx bu7262sxxx bu7264 xx bu7264sxx e mie ? 2 b2 e land pattern data all dimensions in mm pkg land pitch e land space mie land length R? 2 land width b2 ssop5 0.95 2.4 1.0 0.6 sop8 sop14 1.27 4.60 1.10 0.76 ssop-b14 0.65 4.60 1.20 0.35 msop8 0.65 2.62 0.99 0.35 vson008x2030 0.50 2.20 0.70 0.27 pkg radiation land length d3 radiation land width e3 thermal via pitch diameter vson008x2030 1.2 1.6 - 0.3 l2 md1 e b2 d3 e3 thermal via sop8, msop8, sop14 , s s op -b 14 mie ? 2 b 2 e ssop5 vson008x2030 mie ? 2 downloaded from: http:///
datasheet www.rohm.com tsz02201-0rar0g200230-1-2 ? 201 3 rohm co., ltd. all rights reserved. 44 / 44 03.dec.2014 rev.004 tsz22111 ? 15 ? 001 bu7261g bu7261sg bu7262xxx bu7262sxxx bu7264 xx bu7264sxx revision history date revision changes 25.sep.2012 001 new release 06.mar.2014 002 revision is updated only 18.apr.2014 003 addition of bu7264fv,bu7264sfv in the pin configuration(page 2.) 03 .dec.2014 004 correction of figure 7, 9, 30, 32, 34, 53, 55. correction of note 29 33. correction of note31 power dissipation(page 33) downloaded from: http:///
notice- ge rev.003 ? 2013 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. our products are designed and manufactured for application in ordinary electronic equipments (such as av equipment, oa equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). if you intend to use our products in devices requiring extremely h igh reliability (such as medical equipment (note 1) , transport equipment, traffic equipment, aircraft/spacecraft, nuclear powe r controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property ( specific applications ), please consult with the rohm sales representative in adv ance. unless otherwise agreed in writing by rohm in advance, rohm s hall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arisin g from the use of any rohm s products for specific applications. (note1) medical equipment classification of the specific app lications japan usa eu china class class class b class class | class 2. rohm designs and manufactures its products subject to s trict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adeq uate safety measures including but not limited to fail-safe desig n against the physical injury, damage to any property, whic h a failure or malfunction of our products may cause. the followi ng are examples of safety measures: [a] installation of protection circuits or other protective devic es to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditions, as exemplified be low. accordingly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arisi ng from the use of any rohms products under any special or extraordinary environments or conditions. if you intend to use our products under any special or extraordinary environments or conditions (as exemplified belo w), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be n ecessary: [a] use of our products in any types of liquid, including water, oils, chemicals, and organi c solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products are e xposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed t o static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing component s, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4. the products are not subject to radiation-proof design. 5. please verify and confirm characteristics of the final or mou nted products in using the products. 6. in particular, if a transient load (a large amount of load a pplied in a short period of time, such as pulse. is applied, confirmation of performance characteristics after on-board mou nting is strongly recommended. avoid applying power exceeding normal rated power; exceeding the power rating u nder steady-state loading condition may negatively affec t product performance and reliability. 7. de -rate power dissipation (pd) depending on ambient temperature (ta). wh en used in sealed area, confirm the actual ambient temperature. 8. confirm that operation temperature is within the specified range described in the product specification. 9. rohm shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. precaution for mounting / circuit board design 1. when a highly active halogenous (chlorine, bromine, e tc.) flux is used, the residue of flux may negatively affect p roduct performance and reliability. 2. in principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method mu st be used on a through hole mount products. i f the flow soldering method is preferred on a surface-mount p roducts , please consult with the rohm representative in advance. for details, please refer to rohm mounting specification downloaded from: http:///
notice- ge rev.003 ? 2013 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the products and external components, inc luding transient characteristics, as well as static characteristics. 2. you agree that application notes, reference designs, and associated data and information contained in this docu ment are presented only as guidance for products use. therefore, i n case you use such information, you are solel y responsible for it and you must exercise your own independ ent verification and judgment in the use of such information contained in this document. rohm shall not be in any way respon sible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such informat ion. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take pr oper caution in your manufacturing process and storage so t hat voltage exceeding the products maximum rating will not be applied to products. please take special care under dry co ndition (e.g. grounding of human body / equipment / solder iro n, isolation from charged objects, setting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriorate if the products are stored in the places where: [a] the products are exposed to sea winds or corrosive gases, in cluding cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to direct sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage condition, solderab ility of products out of recommended storage time period may be degraded. it is strongly recommended to confirm so lderability before using products of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the correct direction, which is in dicated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a c arton. 4. use products within the specified time after opening a hum idity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage tim e period. precaution for product label qr code printed on rohm products label is for rohm s internal use only. precaution for disposition when disposing products please dispose them properly usi ng an authorized industry waste company. precaution for foreign exchange and foreign trade act since our products might fall under controlled goods prescr ibed by the applicable foreign exchange and foreign trade act, please consult with rohm representative in case of export. precaution regarding intellectual property rights 1. all information and data including but not limited to ap plication example contained in this document is for referen ce only. rohm does not warrant that foregoing information or da ta will not infringe any intellectual property rights or any other rights of a ny third party regarding such information or data. rohm shall not be in any way responsible or liable for infringement of any intellectual property rights or other d amages arising from use of such information or data.: 2. no license, expressly or implied, is granted hereby under any i ntellectual property rights or other rights of rohm or any third parties with respect to the information contained in this d ocument. other precaution 1. this document may not be reprinted or reproduced, in whole or in part, without prior written consent of rohm. 2. the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 3. in no event shall you use in any way whatsoever the products and the related technical information contained in the products or this document for any military purposes, includi ng but not limited to, the development of mass-destruction weapons. 4. the proper names of companies or products described i n this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties. downloaded from: http:///
datasheet datasheet notice ? we rev.001 ? 2014 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. downloaded from: http:///

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